TM 11-6625-2398-14-4
1-13.
Description of Minor Components
connects to processor connector receptacle SIG INTFC
J1 when the processor is installed in a test bed.
a. Extractor 1A1A3 (MX-10412) is used to remove
i. Adapters 1A1A2CP1 through 1A1A2CP13 are
printed wiring cards from processor or module chassis.
used to connect test facility cables to the IFF set, or test
b. Fault isolation card 1AlA4 (MX-9356) provides
equipment cable connectors to cables in the IFF set.
for operation of printed wiring cards when they are
These adapters consist of the following:
extended from the module of chassis and provides the
(1) BNC-male to BNC-male
means to interrupt or to ground signal paths to and from
(2) BNC-female to SMA-male
the extended card.
(3) N-male to BNC-male
c. Dummy load lAlAT1 (DA-636) is a 50 ohm, 50
(4) SMA-male to BNC-female
watt termination used during maintenance of the IFF set.
(5) N-female to N-female
d Dummy loads 1A1A2AT1 and 1A1A2AT2 (DA-558) are
(6) SMA-male to SMC-female
50 ohm terminations used during maintenance of the IFF
(7) SMC-male to SMC-female
set.
(8) SMC-male to SMC-male
e. Dummy load 1AIA2AT3 (DA-559) is a 75 ohm
j. Adapter 1AlA2CP15 (MX-10408) is used with
termination used during maintenance of the IFF set.
diode detector 1A1A2CR1 (CV-3747) for checking
f. Dummy load 1A1A2AT4 (DA-634) is a 5 db
mismatch used during maintenance of the IFF set.
k. Tuning tool 1A1A2MP1 is used for tuning rf
g. Dummy load 1A1A2AT5 (DA-635) is an 11 db
circuits.
mismatch used during maintenance of the IFF set.
l. Two wrenches 1AlA2MP2 and MP3 are provided
for semirigid cable connectors.
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